Produced for engineers, R&D, manufacturing specialists, and end-users of semiconductor packaging worldwide.
The publication is printed eight times a year and covers the chip-scale packaging market with thoroughness unmatched by any other journal. The magazines mission is to promote the growth of the latest semiconductor packaging technologies that influence design assembly and manufacturing utilizing chip-scale electronics. Chip Scale Review is recognized by it's readers as the top publication in it's field. Sign up now to take advantage of the free subscription.
Geographic Eligibility: USA, selected Europe & Asia
